Diamond Slicing and Coring
Slicing with parallel and extremely narrow laser beam kerf. For example, for diamond cutting depth of up to 12mm the kerf width does not exeed 100um.
Recovery of seed (substrate) – cleaning of the polycrystalline crust (coring), multiple slicing and laser polishing for smooth substrate surface – all in one fixing for cutting depth of 20mm or more.
Suitable for manufacturers of synthetic diamond material.