Diamond Sawing Diamond Sawing

Sawing depth up to 100+ mm.

Excellent surface quality.

Width of the laser beam kerf in Parallel Sawing dependent on the depth of the processed diamond material.

for depth up to 10mm - kerf width : 70um

for depth up to 12mm - kerf width : 100um

Sawing kerf : "V"kerf

Straight Line ("V" tilted)

Parallel kerf

Sawing processes : Standard Sawing

Two-Side Sawing (TSS)



Requires use of TSS-360 Cassette or iTSS Cassette.

Suitable for manufacturers of synthetic diamond materials and for gem-diamond manufacturers.